Wet Chemistry for Wafer Texturing
The KOH hood in the Solar Power Laboratory is configured to perform anisotropic etching for surface texturing of silicon. The process is also used for surface damage removal of as-cut wafers and for thinning of silicon substrates. It has a dedicated heated bath currently set up for alkaline processing. In addition to the immersion side, the tool is also configured with a fountain cup for single sided processing.